Products

Home > Packaging Testing Equipment 
Prober  Probe  Instrumentation  Failure Analysis Equipment  Packaging Testing Equipment 

Product Introduction

超高精度倒装芯片贴片机 CB-700

超高精度倒装芯片贴片机 CB-700特点：• Ultra-low load, high-accuracy bonding• Real-time control is possible in the low load range. As a result, bump height variation become minimized.

超高精度倒装芯片贴片机 CB-700

Product Details

超高精度倒装芯片贴片机 CB-700特点： • Ultra-low load, high-accuracy bonding • Real-time control is possible in the low load range. As a result, bump height variation become minimized.

For more information, please contact us。

Go Back