超高精度倒装芯片贴片机 CB-700特点：• Ultra-low load, high-accuracy bonding• Real-time control is possible in the low load range. As a result, bump height variation become minimized.
产品详情
超高精度倒装芯片贴片机 CB-700特点：
• Ultra-low load, high-accuracy bonding
• Real-time control is possible in the low load range. As a result, bump height variation become minimized.
