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精密倒装芯片贴片机 CB-610

简要描述:精密倒装芯片贴片机 CB-610特点:
Correspond to fine pitch of electrodes with mounting accuracy ± 1μm
Correspond yo ultra-low load(0.049N)to high load (490N)without head replacement

  • 产品型号:
  • 厂商性质:生产厂家
  • 更新时间:2024-04-02
  • 访  问  量:1145

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详细介绍

精密倒装芯片贴片机 CB-610

芯片倒装键合机


CB610



功能:贴片应用:倒装焊


特点:

  •   Correspond to fine pitch of electrodes with mounting accuracy  ± 1μm

  •   Correspond yo ultra-low load(0.049N)to high load (490N)without head replacement

  •   follows thermal variation of work and tools in real time

  •   Equipped with recipes for various bonding processes as standard

  •   Feedback of abnormalities by bonding log analysis


Standard Items & Optional Items

<Standard Items>

  • Flip chip unit

  • Constant heat stage

  • ATC( Automatic ceramic tool change )

  • Calibration

  • Process management (logger / export to another PC)

  • Automatic leveling mechanism


<Optional Items>

  • Eutectic head ( No heating )

  • Eutectic purge jig

  • Eutectic stage(□52mm pulse heater

  • Transfer function( Flux, Paste)

  • Dispenser unit( except dispenser)

  • Die bonding

  • Chip imaging camera

  • Gel pack

  • Ultrasonic bonding

  • ID Reading



项目

规格参数

芯片尺寸

1〜20 毫米

基板尺寸(WXL)

5~100mm X 235mm

贴片平台

恒温加热台RT~ ~ 250℃

芯片贴装精度

≤±1微米

低载荷压力范围

0.049~4.9N (5~500g)

高载荷压力范围

4.9~490N (0.5~50kg)

  

 设备尺寸 :1320(W)X 1800(D)X1780(H)mm

精密倒装芯片贴片机 CB-610

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