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超高精度倒装芯片贴片机 CB-700

简要描述:超高精度倒装芯片贴片机 CB-700特点:
• Ultra-low load, high-accuracy bonding
• Real-time control is possible in the low load range. As a result, bump height variation become minimized.

  • 产品型号:
  • 厂商性质:生产厂家
  • 更新时间:2022-06-14
  • 访  问  量:998

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详细介绍

CB700



功能:贴片应用:倒装焊


特点:

• Ultra-low load, high-accuracy bonding

• Real-time control is possible in the low load range. As a result, bump height variation become minimized.

• Supports ultrasonic bonding by exchanging tools

• Available process: ACF、ACP、NCF、NCP、Au-Sn (Eutectic),Au-Au (Ultrasonic),Solder


Standard Item & Optional Items 

[Standard Items]

• Flip chip unit

• Constant heat stage

• ATC(Automatic ceramic tool change)

• Calibration

• Process management(logger/export to another PC)

• Automatic leveling mechanism

• ID Reading

<Optional Items>

• Eutectic head ( No heating)

• Eutectic purge jig

• Eutectic stage (52mm pulse heater)

• Transfer function( Flux, Paste)

• Dispenser unit (except dispenser)

• Die bonding

• Chip imaging camera

• Gel pack

• Ultrasonic bonding




超高精度倒装芯片贴片机 CB-700

项目

规格参数

芯片尺寸

0.3x0.3~30X30mm

基板尺寸(W X L)

200X200 mm 基板 或8英寸 晶圆

邦定力度

长负载范围:0.049~4.9N     高负载范围:4.9~1000N

贴片精度

  ±0.5[μm](3σ)

贴片平台

恒温加热台  RT ~ 250℃

设备尺寸

1320(W) X 2120(D) X 1815(H)mm

超高精度倒装芯片贴片机 CB-700

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