针对高标准的芯片贴装应用，提供高技术力的多功能贴片固晶系统以及高底定制化的方案服务，尤其是对于超薄存储芯片的堆叠装片具有突出表现。多功能全自动芯片贴片固晶机 TB-1000

精密倒装芯片贴片机 CB-610特点： Correspond to fine pitch of electrodes with mounting accuracy ± 1μm Correspond yo ultra-low load（0.049N）to high load (490N）without head replacement

超高精度倒装芯片贴片机 CB-700特点： • Ultra-low load, high-accuracy bonding • Real-time control is possible in the low load range. As a result, bump height variation become minimized.